Download Adhesives Technology for Electronic Applications. Materials, by James J. Licari PDF

By James J. Licari

  • "I suggest this booklet with out reservation to every person in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley


, Pages vii-viii

, Pages ix-x
1 - Introduction

, Pages 1-37
2 - features and conception of Adhesives

, Pages 39-94
3 - Chemistry, formula, and houses of Adhesives

, Pages 95-168
4 - Adhesive Bonding Processes

, Pages 169-260
5 - Applications

, Pages 261-346
6 - Reliability

, Pages 347-391
7 - try and Inspection Methods

, Pages 393-430

, Pages 431-439

, Pages 441-457

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Extra resources for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability

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Soc. Hybrid Microelect. � Harper, C. , and Sampson, R. � Lau, J. � Wong, C. , Engineering Surfaces in Ceramic Pin Grid Array Packaging to Inhibit Epoxy Bleeding, HewlettPackard J. (Aug. , Chip-Scale Packaging Meets Future Design Needs, Solid State Technol. (Apr. � Bauer, C. , Let’s Talk Chip Scale, Circuits Assembly, IPC Supplement (Apr. � Ngulty, T. , and Ekere, N. , Chip Scale vs Flip Chip: Issues to Consider, Circuits Assembly (Nov. � Schueller, R. , pp. 91–94 (Feb. , Advantages of System on a Package and System on a Chip, Electronic Packaging and Production (Jul.

Adhesives for flex circuits must meet several requirements, some of which are as follows: • � Retain adhesion while the circuit is flexed • � Wet and bond well to both the polymer film and the copper foil • � Have low moisture absorption • � Have good dielectric properties • � Have low or no-flow characteristics • Be thermally resistant to solder-reflow temperatures As with PWBs, flex-circuits may be single layer, double sided, or multilayer. ��������������������Chip-on-flex is similar to chip-on-board except that the die, chips, or CSPs are wire bonded, flip-chip attached, or epoxy connected to a flexible circuit instead of to a rigid interconnect substrate such as a PWB.

Together with hydrogen bonding and, in some cases direct-chemical bonding, mechanical interlocking plays a key role in forming strong bonds. 11. Representation of H-bonding of epoxy to an oxide surface. of some materials or encapsulates the peaks and valleys of a rough surface. In both cases, the greater exposed surface areas compared with smooth non-porous surfaces provide greater sites for attachment. Examples include the nascent oxides that are present on the surfaces of metals such as aluminum or purposely formed oxides such as the anodizing of aluminum or the chemical oxidation of copper.

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